All posts tagged: Computer Science

EuroHPC Joint Undertaking launches six new quantum calls 

EuroHPC Joint Undertaking launches six new quantum calls 

Published by skeptic

Superconducting Platform Technologies Through this call, HORIZON-JU-EUROHPC-2026-SPT-10, the EuroHPC JU aims to advance Europe’s superconducting quantum computing capabilities by developing a QPU with at least 1,000individually addressable physical qubits based on chiplet technology facilitating long coherence times, fast read-outs, and error correction capabilities. The system should be  cloud accessible for researchers and industry users, with a focus on demonstrating practical applications for businesses. The selected proposal will need to build a full-stack quantum computing system including hardware, cooling infrastructure, control electronics, and comprehensive software. The action will also support the creation of European supply chains for quantum technology components. The total budget for this call is EUR 20 million, with projects expected to run for 3.5 years. The call is open from 13 August 2026. The application deadline is 17 November 2026. More details can be found on the dedicated page. Neutral-Atom Platform Technologies Through this call, HORIZON-JU-EUROHPC-2026-NAPT-11, the EuroHPC JU aims to advance neutral-atom quantum technologies by delivering scalable, industry-ready quantum processors for simulation and computing. This call should facilitate the development of fully programmable platforms with …

SRC SPARC programme to accelerate semiconductor technologies

SRC SPARC programme to accelerate semiconductor technologies

Published by skeptic

The Semiconductor Research Corporation (SRC) has launched the Semiconductor and Packaging Advanced Research Consortium (SPARC), an industry-led programme intended to speed up research into semiconductor technologies needed for the next generation of microelectronics. The initiative brings together SRC member companies and leading universities to tackle emerging technical challenges across semiconductor design, manufacturing, and advanced packaging. SPARC has already established its first research portfolio, with an industry-funded research council selecting 21 collaborative projects backed by more than $13m in funding. The projects cover areas including advanced transistor architectures, heterogeneous integration, analogue and mixed-signal systems, and manufacturing technologies, creating a research programme spanning much of the semiconductor innovation chain. The programme has also attracted strong interest from academia. Its first research solicitation received nearly 500 concept papers from researchers at 121 universities. The selected projects will focus on three priority areas: Analogue & Mixed-Signal Technologies, Advanced Packaging, and Manufacturing & Devices, with new projects expected to begin on 1 January 2027. Speaking on SPARC, David Henshall, SRC Senior Vice President, said: “SPARC reflects the evolution of how …

Global dependencies and 2030 outlook

Global dependencies and 2030 outlook

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Dr Luigi Capoani and Alberto Corso of the European Youth Think Tank (EYTT) dissect Europe’s semiconductor industry, its global dependencies, and the challenges shaping Europe’s future in chip production. Europe made 13% of the world’s chips in 2010. By 2030, it is forecast to make 8% (European Court of Auditors, 2025). A semiconductor is a material that sits between a conductor and an insulator: it blocks current until something makes it conduct. Adding trace impurities to silicon, or varying the voltage across it, does exactly that. This is how a chip can hold billions of switches without mechanical parts at all. Almost everything electronic now depends on them. Europe’s semiconductor industry is characterised by complex production structures: designing, manufacturing and commercialising chips involves multiple stages, each requiring highly specialised expertise. Research, equipment production, wafer fabrication, assembly, packaging and testing are frequently carried out in different countries. While this highly specialised model has historically driven unprecedented technological advancement and cost efficiency, it has also forged deep, cross-regional dependencies. As the global economy becomes increasingly digitised, these …

EnSilica wins €1.7m satellite chip contract and joins 5G-aNTeNna consortium

EnSilica wins €1.7m satellite chip contract and joins 5G-aNTeNna consortium

Published by skeptic

EnSilica is expanding its role across the EU space sector with a new contract to develop satellite chips for advanced communications infrastructure. The 10-month project will focus on developing system architecture, advanced signal processing algorithms and a working demonstrator, as part of the second phase of a satellite communications application-specific integrated circuit (ASIC) programme for a leading European satellite manufacturer. EnSilica aims to strengthen relationships with the European industry through this contract, as well as deepen technical capabilites. Making connections in the 5G network Alongside the contract award, EnSilica has joined the European 5G-aNTeNna consortium, which is developing user terminal technology for the European Union’s IRIS² satellite constellation. As part of the project, the company will provide application-specific standard products (ASSPs) for satellite user terminals, expanding its presence beyond satellite payload technology into the ground segment of Europe’s sovereign satellite communications network. The initiative also positions EnSilica to benefit from the emerging 5G non-terrestrial network (5G-NTN) market. “EnSilica’s involvement in the 5G-aNTeNna consortium is a natural extension of our work in satellite communications silicon and …

Microsoft’s Quantum Chief Doesn’t Care That Scientists Don’t Believe His Results

Microsoft’s Quantum Chief Doesn’t Care That Scientists Don’t Believe His Results

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The man leading Microsoft’s multibillion-dollar scheme to build a quantum computer says he isn’t interested in appeasing scientists. When Zulfi Alam’s team claimed last year to have effectively split an electron into so-called Majorana quasiparticles in its bid to reinvent computing, some scientists simply didn’t believe the software giant. They cited inconclusive data in Microsoft’s research papers and the lack of peer-review analysis for many of the results. But Alam, Microsoft’s corporate vice president of quantum, tells WIRED with a chuckle, “I don’t really care.” Microsoft is one of several tech powerhouses racing alongside a raft of startups to build commercially useful quantum computers. The goal for these companies is to create computers that could solve currently impossible problems in fields from drug development to defense by exploiting quantum mechanics to process units of information, known as bits, in a fundamentally different way than how classical machines do. (There are also concerns that quantum computers will be used to crack encryption.) Companies are taking different approaches to constructing quantum bits—“qubits” for short—including using neutral atoms, …

US commits 4m to strengthen semiconductor supply chain

US commits $874m to strengthen semiconductor supply chain

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The US Department of Commerce has announced plans to provide up to $874m in federal funding to seven technology companies under the CHIPS and Science Act, aiming to accelerate next-generation semiconductor research and strengthen the semiconductor supply chain. The proposed investments, announced through signed letters of intent, will support research and development across advanced computing technologies, including integrated photonics, AI memory, advanced packaging, semiconductor materials and secure electronics. The awards remain subject to due diligence and final government approval. Officials say the funding will help expand domestic innovation, reduce reliance on overseas technologies and reinforce the United States’ position in the global semiconductor supply chain while supporting future advances in AI, defence, healthcare, robotics and industrial manufacturing. Funding targets critical semiconductor technologies The seven proposed awards focus on technologies considered essential to future AI infrastructure and high-performance computing. The largest allocation, worth up to $300m, is earmarked for GlobalFoundries to accelerate research into co-packaged optics. The technology integrates photonics directly with AI processors, increasing data transfer speeds while reducing energy consumption. According to the Department …

How EUPEX is shaping Europe’s HPC future

How EUPEX is shaping Europe’s HPC future

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From Europe’s first HPC processor to application readiness and software innovation, EUPEX is bringing together the technologies that will power future European supercomputers High-performance computing plays a critical role in science, industry, and innovation. While Europe operates some of the world’s most powerful supercomputers, maintaining long-term technological sovereignty requires more than access to computing resources: it also depends on the ability to develop and integrate key technologies within Europe itself. This is the ambition behind EUPEX (European Pilot for Exascale), a project funded by the EuroHPC Joint Undertaking. Rather than developing a single technology, EUPEX brings together a wide range of European hardware and software components within a common platform to assess their readiness for future HPC systems. The project serves as a bridge between technology development and large-scale deployment, providing a realistic environment in which new European solutions can be integrated, evaluated, and improved. The consortium brings together 17 partners from across Europe, including supercomputing centres, research organisations, universities, and technology companies. Coordinated by Bull, the project combines expertise in system architecture, software, application …

European Processor Initiative: Project concluded

European Processor Initiative: Project concluded

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Following the conclusion of the project, the European Processor Initiative outlines its advancements in sovereign chip technology for supercomputing and artificial intelligence (AI) during a final review in Luxembourg. The European Processor Initiative, a project of 27 partners, funded by the EuroHPC Joint Undertaking and Croatia, France, Germany, Greece, Italy, Netherlands, Portugal, Spain, Sweden, and Switzerland, concluded successfully four months ago, and has now undergone the final review in Luxembourg. After four years of the SGA2 project phase, the representatives of the partners presented their work to the reviewers and EuroHPC JU staff. In addition to the standard project review process, this one also had a special item on the schedule. The review was a special opportunity for the project consortium to showcase the results of their work – especially in the context of two processor families that were being developed – the Arm-based GPP brought up by SiPearl, and the European processor accelerator – EPAC – at the review. This is why the review also organised two types of demonstrations for the reviewers and …

Advancing multicore fiber technologies for future applications

Advancing multicore fiber technologies for future applications

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The MATCH project is a European doctoral training network advancing multicore fiber technologies through collaboration between 14 academic and industrial partners. As artificial intelligence, cloud computing, video streaming, 5G networks, and the Internet of Things continue to accelerate digital transformation, global data traffic is growing at an unprecedented rate. To support this growth, future communication infrastructures must provide significantly greater transmission capacity while reducing energy consumption and optimising network resources. One of the most promising solutions is multicore fiber (MCF) technology. By integrating multiple optical cores within a single fiber, MCFs enable parallel transmission channels that can dramatically increase communication capacity while maintaining compatibility with existing optical network infrastructures. In addition to telecommunications, MCFs are opening new possibilities in distributed sensing applications, including environmental monitoring, fire detection, seismic activity monitoring, and structural health assessment. Technology for the next generation of networks Conventional single-mode fibers have enabled decades of growth in global communications. However, with traffic volumes continuing to increase, entirely new approaches are needed to scale network capacity in a sustainable manner. Space-Division Multiplexing (SDM) …

FAST secures 0m to drive Oregon’s semiconductor industry

FAST secures $160m to drive Oregon’s semiconductor industry

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Oregon’s Frontiers of Advanced Semiconductor Technology (FAST) consortium has been selected as one of the United States National Science Foundation’s (NSF) Regional Innovation Engines, unlocking an initial $15m award and the opportunity to secure up to $160m over the next decade. The funding aims to accelerate innovation, workforce development and commercialisation across the semiconductor industry. Administered by Oregon State University, FAST brings together nearly 100 partners spanning higher education, industry, government, investors and nonprofit organisations. The initiative is designed to strengthen Oregon’s established semiconductor ecosystem while supporting new research, startup creation and advanced manufacturing capabilities. The award places Oregon among 12 NSF Regional Innovation Engines selected across 20 states. If FAST achieves key performance milestones during its initial two-year phase, it will become eligible for additional funding, helping expand regional economic growth while reinforcing US leadership in critical technologies. Building on years of investment FAST was established by Oregon State University in 2022 to unite organisations involved in semiconductor research, manufacturing and workforce development. In 2023, the consortium received $1m through the NSF Engines development …