SEOUL, March 18 : Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial intelligence infrastructure, the companies said on Wednesday. The agreement will focus on supplying Samsung’s next-generation high-bandwidth memory (HBM4) for AMD’s upcoming Instinct MI455X AI accelerators, as well as optimised DDR5 memory for AMD’s sixth-generation EPYC processors, they said in a statement. The companies will also discuss opportunities for a foundry partnership, under which Samsung could provide contract chip manufacturing services for next-generation AMD products. Under the agreement, Samsung will position itself as a key HBM4 supplier for AMD’s next-generation AI GPUs. The South Korean firm has already been a primary HBM supplier for AMD, supplying HBM3E chips used in AMD’s MI350X and MI355X accelerators. The agreement comes during the week of Nvidia’s annual developer conference GTC, where CEO Jensen Huang on Monday announced a foundry partnership with the Korean firm and praised its HBM4 chips. The tie-up highlights a broader race among global chipmakers to lock in long-term …