It’s still an extremely challenging proposition. “Packaging is not as easy as saying, ‘I want to run 100,000 wafers per month,’” says Jim McGregor, a longtime chip industry analyst and the founder of Tirias Research, referring to a continuous flow of chips in various stages of production. “It really comes down to whether Intel’s [packaging] fabs can make deals. If we see them expanding those operations more, that’s an indicator that they have.” Last month, Anwar Ibrahim, the prime minister of Malaysia, revealed in a post on Facebook that Intel is expanding its Malaysian chip-making facilities, which were first established back in the 1970s. Ibrahim said the head of Intel’s Foundry, Naga Chandrasekaran, had “outlined plans to commence the first phase” of expansion, which would include advanced packaging. “I welcome Intel’s decision to begin operations for the complex later this year,” a translated version of Ibrahim’s post read. An Intel spokesperson, John Hipsher, confirmed that it’s building out additional chip assembly and test capacity in Penang, “amid rising global demand for Intel Foundry packaging solutions.” …